Kutumiza Kwaulere Pazogulitsa Zonse za BUSHNELL

Mphamvu yaukadaulo wapano wa PCB pamtundu wowotcherera

Chithandizo chamtundu wa PCB ndichinsinsi ndi maziko a mtundu wa chigamba cha SMT. Njira zochizira ulalowu zimaphatikizapo mfundo zotsatirazi. Lero, ndikugawana zomwe zandichitikira paukadaulo woyang'anira dera:
(1) Kupatula ENG, makulidwe osanjikizawo sanafotokozeredwe bwino pamitundu yonse ya PC. Zimangofunikira kukwaniritsa zofunikira za solderability. Zofunikira pakampaniyi ndi izi.
OSP: 0.15 ~ 0.5 μm, osatchulidwa ndi IPC. Analimbikitsa ntchito 0.3 ~ 0.4um
EING: Ni-3 ~ 5um; Au-0.05 ~ 0.20um (PC imangotulutsa zofunikira kwambiri za thinnest)
Im-Ag: 0.05 ~ 0.20um, wonenepa kwambiri, dzimbiri ndi (PC silinatchulidwe)
Im-Sn: -0.08um. Chifukwa chakulimba ndikuti Sn ndi Cu zipitilizabe kukhala CuSn kutentha, komwe kumakhudza kusungunuka.
HASL Sn63Pb37 imapangidwa mwachilengedwe pakati pa 1 ndi 25um. Ndizovuta kuwongolera moyenera njirayi. Wopanda kutsogolera amagwiritsa makamaka SnCu alloy. Chifukwa cha kutentha kwakukulu, ndizosavuta kupanga Cu3Sn yokhala ndi mawu osawoneka bwino, ndipo sagwiritsidwa ntchito pakadali pano.

(2) Kukhazikika kwa SAC387 (malinga ndi nthawi yonyowetsa munthawi zosiyanasiyana zotentha, unit: s).
Nthawi 0: im-sn (2) kukalamba kwa florida (1.2), osp (1.2) im-ag (3).
Zweiter PLENAR SESSION Zweiter PLENAR SESSION Im-Sn ali ndi kuthana bwino ndi dzimbiri, koma kulimbikira kwake ndi kovutirapo!
Nthawi 4: ENG (3) -ImAg (4.3) -OSP (10) -ImSn (10).

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(3) Kukhazikika kwa SAC305 (mutadutsa mu ng'anjo kawiri).
ENG (5.1) -Im-Ag (4.5) -Im-Sn (1.5) -OSP (0.3).
M'malo mwake, okonda masewerawa atha kusokonezeka kwambiri ndi akatswiriwa, koma ziyenera kuzindikiridwa ndi omwe amapanga PCB proofing ndi patching.


Nthawi yamakalata: Meyi-28-2021